The grant­ed patent cov­ers dif­fer­ent aspects of appli­ca­tion of nanos­truc­tures in the field of inter­con­nect­ing two adja­cent lay­ers which in this case may for exam­ple be two sil­i­con chips (die) for elec­tron­ic pack­ag­ing purposes.

“We are wit­ness­ing the expan­sion of our patent port­fo­lio towards dif­fer­ent appli­ca­tions of our nanos­truc­ture tech­nol­o­gy. This par­tic­u­lar patent is strength­en­ing our posi­tion with­in the advanced pack­ag­ing seg­ment for inte­grat­ed cir­cuits with high­er per­for­mance at a small­er foot­print”, says Dr. M. Shafiq Kabir, Smoltek´s CIO.

Smoltek’s patent port­fo­lio now glob­al­ly com­pris­es 51 grant­ed patents. Read more about our IP and patents here.