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Smoltek’s IP related to interposer technology keeps growing. This new US patent is covering energy storage devices embedded in an interposer, and manufacturing of the same. Our patent portfolio now comprises 62 granted patents.
Smoltek’s inventions facilitate integration of extremely thin solid-state energy storage devices, CNF-MIM capacitors, closer to the interconnection points and power rails of the active chips. The CNF-MIM technology offers the industry’s smallest formfactor for high-performance capacitors by providing a very high capacitance per area at a fragment of the height compared to today’s technologies.
In the semiconductor industry the Advanced Packaging and Heterogeneous Integration concepts offers architectures for increased functionality and enhanced performances on a system level together with an ever-smaller footprint. Interposers are important building-blocks in these architectures. Silicon interposers have so far mainly been utilized for high-end semiconductors such as high-performance GPUs, CPUs, FPGAs, and HBMs, while the mid-end segment has a greater share of organic interposers due to cost issues. The point is that interposers today is a key sub-component and a main staple technology.
With this newly granted patent, we are expanding our interposer-related protection scheme on the US market.
“Interposers are frequently and increasingly used in advanced semiconductor products. We are happy to make our technology even more relevant to the industry by facilitating further improved performance and thereby adding significant value.”, says Dr Shafiq Kabir, Founder and Chief Innovation Officer at Smoltek.
Traditionally, an interposer has been used only for passive redistributions layers (RDL) or interconnects for other dies to be connected. Over time other passive functionality has been added, such interposers are often referred to as “smart interposers”. Our patented concept comprises energy storage devices, e.g. capacitors, solid state micro batteries etc., to be embedded in the interposer structure.
The market for such interposers is anticipated to steadily grow in the field of Advanced Packaging and Heterogeneous Integration. Our Compact Energy Storage Interposer family is complementary to our other Interposer families and offers an additional path to utilize our CNF-MIM technology.
Smoltek’s patent portfolio now globally comprises 62 granted patents. Read more about our IP and patents.
Image: Shafiq Kabir, CIO at Smoltek
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News
October 20, 2026
Smoltek has engaged Dr. Philip Lessner, formerly Executive Vice President and Chief Technology Officer (CTO) of Yageo Group, as a senior advisor to strengthening Smoltek Semi’s industrial expertise and the effort to commercialize CNF-MIM technology for ultra-thin capacitors within the semiconductor sector.
News
October 14, 2026
Smoltek Semi participated in the IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2026), a leading European forum for the development of next-generation semiconductor and electronic systems.
News
October 5, 2026
Smoltek Semi attended the European technology conference ECOC 2026 to identify how the company’s ultra-thin capacitor technology, CNF-MIM, can create value within optical communication applications.
News
September 16, 2026
Between September 7–9, Smoltek’s CTO, Farzan Ghavanini, participated in the Business Sweden semiconductor delegation to Japan, meeting with leading companies and organizations across the Japanese semiconductor ecosystem.
News
May 15, 2026
Smoltek has been granted an additional patent within its Interposer patent family, further protecting the company’s CNF-MIM capacitor technology for advanced semiconductor packaging. With this European patent approval, the company has secured Interposer IP in all major global markets.
News
March 27, 2026
Our CNF-MIM technology has demonstrated stable electrical performance after 2,000 hours in an independent life test conducted by a global capacitor manufacturer. This further strengthens confidence in the reliability of the technology and supports Smoltek's development of advanced capacitors for AI, RF and optoelectronics, among other applications.