Patents

The Inter­pos­er fam­i­ly is cov­er­ing Smoltek’s CNF-MIM capac­i­tors tech­nol­o­gy and var­i­ous use cas­es for the same, pri­mar­i­ly in the field of inter­posers for advanced pack­ag­ing and het­eroge­nous inte­gra­tion of semiconductors. 

The Cat­a­lyst Dif­fu­sion fam­i­ly is cov­er­ing a method for man­u­fac­tur­ing a plu­ral­i­ty of nanos­truc­tures on a substrate. 

The Nano Imprint Lith­o­g­ra­phy fam­i­ly is cov­er­ing a method of mak­ing high aspect ratio tem­plate, stamp, and imprint­ing at nanoscale using nanostructures. 

The Helplay­er fam­i­ly is cov­er­ing a method to pro­tect the under­lay­ing sub­strate or mate­ri­als from being dam­aged dur­ing the nanos­truc­ture growth process.

The Bump­ing fam­i­ly is an appa­ra­tus con­nect­ing and bond­ing adja­cent lay­ers with nanostructures. 

The Inter­con­nects B fam­i­ly is cov­er­ing how nanos­truc­tures can be used as inter­con­nects and/​or for dis­si­pat­ing heat from elec­tron­ic devices. 

The Nanos­truc­ture IC fam­i­ly is cov­er­ing a method for the man­u­fac­ture of an inte­grat­ed cir­cuit com­pris­ing nanostructures.

The Inter­con­nects A fam­i­ly is cov­er­ing a method regard­ing con­trolled growth of a nanos­truc­ture on a sub­strate, and elec­tron emis­sion devices based on the same. 

The Nanos­truc­ture E‑beam writer fam­i­ly is cov­er­ing a method for the man­u­fac­ture of an inte­grat­ed cir­cuit com­pris­ing nanostructures.