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Smol­tek uses a glob­al pat­ent strategy to pro­tect our tech­no­logy plat­form in all import­ant mar­kets. This includes core pat­ents as well as pat­ent pro­tec­tion at applic­a­tion level. At present, we have a pat­ent port­fo­lio that com­prises about 110 applied and pending pat­ents, dis­trib­uted among 20 pat­ent fam­il­ies, of which 80 are granted. 

The stra­tegic and con­tinu­ous devel­op­ment of our pat­ent port­fo­lio is driv­en by the need for dis­rupt­ive mater­i­als and tech­nic­al solu­tions that enables indus­tri­ally com­pat­ible fab­ric­a­tion of nano­struc­tures for vari­ous applic­a­tions, like ultra-thin capa­cit­ors and new high-per­form­ance cell mater­i­al for electrolyzers. 

Our innov­at­ive tech­no­logy plat­form is pro­tec­ted with an IP-port­fo­lio of +110 pat­ents gran­ted and pending, as well as a sig­ni­fic­ant body of know-how and trade secrets.

Smoltek Patent No 80 Electro Catalyst Support

Electro Catalyst Support

The Electro Catalyst Support family is covering an electrolyzer and a method for producing a catalyst supported on a nanostructure. The innovation is targeted towards the production of green hydrogen and discloses how carbon nanofibers can support the iridium catalyst load in a PEM-electrolyzer in a better way.

Discrete CNF-MIM

The Discrete CNF-MIM patent family is covering a method for manufacturing of discrete capacitor components based on our CNF-MIM technology. The innovation exploits the extra-ordinary surface to volume ratio provided by carbon nanofibers to create a MIM capacitor with unparalleled high capacitance density.

Assembly platform

The Assembly platform family is a particular application in the field of interconnects and heterogeneous integration.


The Interposer family is covering Smoltek's CNF-MIM capacitors technology and various use cases for the same, primarily in the field of interposers for advanced packaging and heterogenous integration of semiconductors.

Catalyst Diffusion

The Catalyst Diffusion family is covering a method for manufacturing a plurality of nanostructures on a substrate.

Nano Imprint Lithography

The Nano Imprint Lithography family is covering a method of making high aspect ratio template, stamp, and imprinting at nanoscale using nanostructures.


The Helplayer family is covering a method to protect the underlaying substrate or materials from being damaged during the nanostructure growth process.


The Bumping family is an apparatus connecting and bonding adjacent layers with nanostructures.

Interconnects B

The Interconnects B family is covering how nanostructures can be used as interconnects and/or for dissipating heat from electronic devices.

Nanostructure IC

The Nanostructure IC family is covering a method for the manufacture of an integrated circuit comprising nanostructures.

Interconnects A (SmolGROW™)

The Interconnects A family is covering a method regarding controlled growth of a nanostructure on a substrate, and electron emission devices based on the same.