Smoltek’s 74th patent has been grant­ed in the US and relates to the Assem­bly plat­form fam­i­ly, which is a path­way to tap into the ever-increas­ing demand for minia­tur­iza­tion of elec­tron­ic com­po­nents and inter­con­nect them in the form of an assem­bly to min­i­mize foot­print at the pack­ag­ing level.

“Through this new patent grant we widen our glob­al IP-foot­print, and again show­case the great dis­rup­tive poten­tial of our tech­nol­o­gy platform.”,

says Farzan Gha­vani­ni, CTO at Smoltek.

In the con­text of our Assem­bly plat­form and inter­con­nects, the present appli­ca­tions con­cepts take advan­tage of the wet­ta­bil­i­ty prop­er­ties of nanos­truc­tures to form small sized com­pos­ite inter­con­nect bumps togeth­er with tra­di­tion­al solder/​metal mate­ri­als. Such com­pos­ite inter­con­nects pro­vide a means to improve the elec­tri­cal reli­a­bil­i­ty of the solder/​metal bumps since car­bon nanos­truc­tures are inher­ent­ly capa­ble of car­ry­ing high cur­rent at a much small­er footprint.

Smoltek’s patent port­fo­lio now glob­al­ly com­pris­es 74 grant­ed patents. Read more about our IP and patents.