Smoltek’s 74th patent has been granted in the US and relates to the Assembly platform family, which is a pathway to tap into the ever-increasing demand for miniaturization of electronic components and interconnect them in the form of an assembly to minimize footprint at the packaging level.
“Through this new patent grant we widen our global IP-footprint, and again showcase the great disruptive potential of our technology platform.”,says Farzan Ghavanini, CTO at Smoltek.
In the context of our Assembly platform and interconnects, the present applications concepts take advantage of the wettability properties of nanostructures to form small sized composite interconnect bumps together with traditional solder/metal materials. Such composite interconnects provide a means to improve the electrical reliability of the solder/metal bumps since carbon nanostructures are inherently capable of carrying high current at a much smaller footprint.
Smoltek’s patent portfolio now globally comprises 74 granted patents. Read more about our IP and patents.