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At the annual IEEE Electronic Component and Technology Conference 2019 Smoltek presented new and improved measurement data for the CNF-MIM capacitance density – now in the range over 350nF/mm^2.
The tech-team has worked really hard with the development of our CNF-MIM capacitor technology. And now at ECTC 2019 in Las Vegas, we can present the confirmed results of that specific work.
Vincent, CTO at Smoltek says: “I am very pleased to have presented the latest results of our CNF-MIM technology at ECTC2019, which demonstrates capacitance densities in excess of 350 nF/mm^2. It is important to expose our technology to the electronics packaging community. This enables our technical team to synchronize the further optimization of our CNF-MIM technology with the industry’s actual needs.”
Smoltek is continuously in process of optimizing the concept design in order to make it more flexible and to address other important parameters like ESR and ESL of the CNF-MIM capacitors. Furthermore, the enhancement of CNF-MIM performance metrices are always confirmed by more than one 3rd party verifications.
Image: Vincent Desmaris, CTO at Smoltek
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News
June 27, 2025
Smoltek Semi has cleared a significant milestone in the development of next-generation CNF-MIM capacitors. Samples from the latest prototype generation, fabricated with an advanced dielectric stack composed of zirconium oxide (ZrO₂) and aluminum oxide (Al₂O₃) have demonstrated exceptional stability under both temperature and voltage stress.
News
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Smoltek Semi has initiated the signing of a technical service agreement with the Taiwanese Industrial Technology Research Institute (ITRI) that enables low-volume production of Smoltek's propriety CNF-MIM capacitors.
Media mentions
June 17, 2025
This is a summary of an article featuring Smoltek titled "Smoltek bryter teknisk barriär och efterlyser pengar" published by elektroniktidningen on June 16, 2025.
IR Blog Posts
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Smoltek Semi joins an elite club of companies achieving 1 µF/mm² capacitance density, but stands alone in reaching this milestone with an ultra-thin profile. This breakthrough unlocks the under-chip real estate that represents the holy grail of capacitor placement in modern electronics.
News
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