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Watch Françoise von Trapp (3D InCites) interview with CRO & COO, Ola Tiverman from this year's virtual SEMICON West.
3D InCites is an online media resource focusing on 3D integration and heterogeneous integration. As a community, 3D InCites brings to life the people, the personalities, and the minds behind heterogeneous integration and related technologies in a uniquely personal way. The goal is to inform key decision-makers about progress in technology development, design, standards, infrastructure, and implementation.
The interview was made over Zoom and got our CRO & COO, Ola Tiverman to get into the 3DInCites virtual booth at this year’s SEMICON West. Thank’s for the invitation!
Video: Ola Tiverman, CRO & COO at Smoltek and Francoise Von Trapp, 3DInCites
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News
June 18, 2025
Smoltek Semi has initiated the signing of a technical service agreement with the Taiwanese Industrial Technology Research Institute (ITRI) that enables low-volume production of Smoltek's propriety CNF-MIM capacitors.
Media mentions
June 17, 2025
This is a summary of an article featuring Smoltek titled "Smoltek bryter teknisk barriär och efterlyser pengar" published by elektroniktidningen on June 16, 2025.
IR Blog Posts
June 16, 2025
Smoltek Semi joins an elite club of companies achieving 1 µF/mm² capacitance density, but stands alone in reaching this milestone with an ultra-thin profile. This breakthrough unlocks the under-chip real estate that represents the holy grail of capacitor placement in modern electronics.
News
June 12, 2025
Smoltek Hydrogen is developing Smoltek PTE – a proprietary porous transport electrode based on carbon nanostructures, which is intended to meet the requirements of next-generation PEM electrolyzers for the production of fossil-free hydrogen.
News
June 11, 2025
Smoltek Semi has successfully engineered an advanced dielectric stack that surpasses 1 microfarad per Square millimeter capacitance milestone.
News
June 11, 2025
Smoltek Semi develops CNF-MIM – a proprietary capacitor technology based on carbon nanofibers, which is intended to meet the demands of next-generation electronics, including applications in AI, smartphones and automotive electronics.