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Contact Resistance
The Contact Resistance patent family is covering how to improve a separator plate arrangement for an electrochemical cell by comprising a nanostructure which offers lowered contact resistance between the separator element and the diffusion layer.
Read moreContact Resistance
Flip chip interconnects based on carbon nanofibers-solder composites
Research paper published in the proceedings of 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 2229-2234.
Read moreFlip chip interconnects based on carbon nanofibers-solder composites
Reliability, solderability and electrical performance of high density ultra thin capacitors based on carbon nanofibers
Research paper published in the proceedings of 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 1627-1632.
Read moreReliability, solderability and electrical performance of high density ultra thin capacitors based on carbon nanofibers
High-frequency electrical circuit model for integrated capacitors utilizing lossy nanostructures
Research paper published in the proceedings of 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 1205-1210.
Read moreHigh-frequency electrical circuit model for integrated capacitors utilizing lossy nanostructures
Ultrathin High-Density Capacitors based on Carbon Nanofibers Fabricated on Silicon, Alumina and Glass Interposer Materials
Research paper published in the proceedings of 2020 IEEE 20th International Conference on Nanotechnology (IEEE-NANO), 2020, pp. 213-216.
Read moreUltrathin High-Density Capacitors based on Carbon Nanofibers Fabricated on Silicon, Alumina and Glass Interposer Materials
Robustness of carbon nanofiber-based MIM capacitors with ultra-high capacitance density to electrical and thermal stress
Research paper published in the proceedings of 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, pp. 2139-2144.
Read moreRobustness of carbon nanofiber-based MIM capacitors with ultra-high capacitance density to electrical and thermal stress
Integrated and Discrete Ultra-Thin Capacitors Based on Carbon Nanofibers with High Capacitance Density
Research paper published in the proceedings of 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, pp. 1614-1619.
Read moreIntegrated and Discrete Ultra-Thin Capacitors Based on Carbon Nanofibers with High Capacitance Density