Reliability, solderability and electrical performance of high density ultra thin capacitors based on carbon nanofibers

This paper invest­ig­ates the suit­ab­il­ity of the Car­bon Nano-Fiber Met­al-Insu­lat­or-Met­al (CNF-MIM) capa­cit­or for integ­ra­tion in future mini­atur­ized elec­tron­ics. The CNF-MIM has pre­vi­ously shown elec­tric­al prop­er­ties suit­able for use in a vari­ety of applic­a­tions such as digit­al elec­tron­ics. The CNF-MIM capa­cit­ors are sub­jec­ted to high ambi­ent tem­per­at­ure and con­stant voltage bias envir­on­ments over long peri­ods of time to assess their long-term dur­ab­il­ity. The devices are also sub­jec­ted to stand­ard sur­face-mount solder reflow pro­ced­ure to invest­ig­ate the com­pat­ib­il­ity with industry-stand­ard assembly tech­niques. The capa­cit­ors are char­ac­ter­ized in both DC and RF and are shown to be robust against degrad­a­tion in these scen­ari­os. Finally, ultra-thin CNF-MIM capa­cit­ors are man­u­fac­tured, show­ing that the estab­lished tech­no­logy can be fur­ther shrunk for fur­ther mini­atur­iz­a­tion and future applications.