Sign up for our newsletter!
Your data will be handled in compliance with our privacy policy.
News
June 12, 2017
Smoltek congratulate our first industrial PhD
Muhammad Amin has defended his thesis successfully. The opponent was Professor François Béguin, from Poznan University of Technology, Poland, a distinguished professor in the field of super capacitors.
News
June 9, 2017
New Korean patent granted
Further expansion of Smoltek’s footprint on patent portfolio in Asia.
Research
June 1, 2017
Carbon nanomaterial-based interconnects, integrated capacitors and supercapacitors
PhD thesis, Chalmers Univeristy of Technology, 2017.
News
May 8, 2017
Smoltek is going to ECTC 2017
Our industrial PhD student Muhammad Amin is one of 8 winners selected by the CPMT Awards committee for ECTC Travel Award with the abstract “On-Chip Integrated Solid State Micro-Supercapacitor.”
Patents
May 3, 2017
Assembly platform
The Assembly platform family is a particular application in the field of interconnects and heterogeneous integration.
News
April 19, 2017
Publication is Highlight of 2016
Our publication about supercapacitor performance is selected as a Highlight of 2016 by Journal of Micromechanics & Microengineering.
News
March 17, 2017
Smoltek announces its 45th granted patent
The present European patent covers an aspect of essential growth related method to enable growing nanostructures on a substrate e.g. carbon nanotubes, nanofibers, nanowires etc.
Patents
February 24, 2017
Interposer
The Interposer family is covering Smoltek's CNF-MIM capacitors technology and various use cases for the same, primarily in the field of interposers for advanced packaging and heterogenous integration of semiconductors.
News
February 22, 2017
Granted European Patent
Smoltek just received a patent letter of a new granted patent in Europe.
News
February 2, 2017
New Chairman of the Board for Smoltek AB
Ulf Börjel has enrolled the position of new Chairman of the Board since January 2017.
News
January 26, 2017
Smoltek is featuerd in IEEE Spectrum
We are very happy to be featured in IEEE Spectrum. IEEE Spectrum is the flagship magazine and website of the IEEE, the world’s largest professional organization devoted to engineering and the applied sciences.
News
January 10, 2017
New Taiwanese Patent
We are happy to announce a new core patent in Taiwan. This is Smoltek´s third granted patent in Taiwan.
Research
September 29, 2016
Hierarchical cellulose-derived CNF/CNT composites for electrostatic energy storage
Research paper published in Journal of Micromechanics and Microengineering, 2016, Volume 26, Number 12.
Research
August 2, 2016
Performance Enhancement of Carbon Nanomaterials for Supercapacitors
Research paper published in Journal of Nanomaterials, vol. 2016, Article ID 1537269, 17 pages, 2016.
Research
May 17, 2016
Development of Supercapacitor based on carbon nanostructures as electrode materials
Research paper in the proceedings of Micronano System Workshop MSW 2016, Lund, Sweden, 17–18 May, 2016.
Research
December 1, 2015
Hierarchical cellulose-derived carbon nanocomposites for electrostatic energy storage
Research paper in the proceedings of The 15th International Conference on Micro and Nanotechnology for Power Generation and Energy Conversion Applications (PowerMEMS 2015), Boston, USA, 1–4 December, 2015.
Research
April 6, 2015
Examining Carbon Nanofibers: Properties, growth, and applications
Research paper published in IEEE Nanotechnology Magazine, Volume 9, Number 2, June 2015, pp. 33–38.
Research
February 25, 2015
CMOS compatible on-chip decoupling capacitor based on vertically aligned carbon nanofibers
Research paper published in Solid–State Electronics, Volume 107, May 2015, pp. 15–19.
Research
February 25, 2015
Low temperature and cost-effective growth of vertically aligned carbon nanofibers using spin-coated polymer-stabilized palladium nanocatalysts
Research paper published in Science and Technology of Advanced Materials, 2015, Volume 16, Issue 1.
Research
December 28, 2014
Carbon Nanofibers (CNF) for Enhanced Solder-based Nano-Scale Interconnects and Packaging Solutions
Research paper in the proceedings of Semicon Taiwan 2014.