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Interconnects B
The Interconnects B family is covering how nanostructures can be used as interconnects and/or for dissipating heat from electronic devices.
The invention: A way of manufacture nanostructures grown on a conducting or insulating substrate, and a method of making the same. The nanostructures grown according to the claimed method are suitable for interconnects and/or as heat dissipators in electronic devices.
Granted patents relating to the innovation
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Related news and insights
Smoltek patent No. 78 now granted
Smoltek has yet another patent granted. This time in China, and it is related to the Assembly platform patent family in the direction of interconnects. This also makes our patent portfolio to now comprise 78 granted patents.
Flip chip interconnects based on carbon nanofibers-solder composites
Research paper published in the proceedings of 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 2229-2234.
Carbon nanomaterial-based interconnects, integrated capacitors and supercapacitors
PhD thesis, Chalmers Univeristy of Technology, 2017.
Carbon Nanofibers (CNF) for Enhanced Solder-based Nano-Scale Interconnects and Packaging Solutions
Research paper in the proceedings of Semicon Taiwan 2014.
A Test Vehicle for RF/DC Evaluation and Destructive Testing Of Vertically Grown Nanostructures (VGCNS)
Research paper in the proceedings of NT11 International Conference on the Science and Application of Nanotubes, University of Cambridge, United Kingdom, July 10–16, 2011.
Interconnects A (SmolGROW™)
The Interconnects A family is covering a method regarding controlled growth of a nanostructure on a substrate, and electron emission devices based on the same.