Integrated circuits having interconnects and heat dissipators based on nanostructures

The present inven­tion relates to a heat dis­si­pa­tor that includes a con­duc­tive sub­strate and a plu­ral­i­ty of nanos­truc­tures sup­port­ed by the con­duc­tive sub­strate. The nanos­truc­tures are at least part­ly embed­ded in an insu­la­tor. Each of the nanos­truc­tures includes a plu­ral­i­ty of inter­me­di­ate lay­ers on the con­duc­tive sub­strate. At least two of the plu­ral­i­ty of inter­me­di­ate lay­ers are inter­dif­fused, and mate­r­i­al of the at least two of the plu­ral­i­ty of inter­me­di­ate lay­ers that are inter­dif­fused is present in the nanostructure.

Granted patents relating to the innovation

Patent OfficePatent
IndiaIN266759
USAUS7777291
USAUS8183659
USAUS8415787
For more infor­ma­tion about a par­tic­u­lar patent, click on its name to view it on Google Patents.

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