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Smoltek has yet another patent granted. This time in China, and it is related to the Assembly platform patent family in the direction of interconnects. This also makes our patent portfolio to now comprise 78 granted patents.
Smoltek’s 78th patent has been granted in China and relates to the Assembly platform family, which is a particular application in the field of interconnects and heterogeneous integration.
“Our Assembly platform patent family is a pathway to tap into the increasing demand for miniaturization of electronic components and interconnect them in the form of an assembly to minimize footprint at the packaging level”,says Farzan Ghavanini, CTO at Smoltek.
In the context of our Assembly platform and interconnects, the present applications concepts take advantage of the wettability properties of nanostructures to form small sized composite interconnect bumps together with traditional solder/metal materials. Such composite interconnects provide a means to improve the electrical reliability of the solder/metal bumps since carbon nanostructures are inherently capable of carrying high current at a much smaller footprint.
Smoltek’s patent portfolio now globally comprises 78 granted patents. Read more about our IP and patents.