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Smoltek has been granted two new patents
Smoltek’s 75th patent has been granted in Taiwan and is covering the concept and manufacturing of extremely thin energy storage devices embedded in an interposer. The energy storage device concepts can take a large number of forms e.g. discrete, integrated – or it may take the form where the end result is an interposer with CNF-MIM capacitors embedded in it. And the Compact energy storage interposer family is developed to capture around that concept. “Through these two new patents, Smoltek again proves our ability both in technical and innovative capabilities of widening our IP footprint”, says Farzan Ghavanini, CTO and Head of R&D at Smoltek. Smoltek’s 76th patent has been granted in Korea and relates to the Assembly platform family in the field of interconnects and heterogeneous integration. This particular patent family is a pathway to tap into the ever-increasing demand for miniaturization of electronic components and interconnect them in the form of an assembly to minimize footprint at the packaging level. Smoltek’s patent portfolio now globally comprises 76 granted patents. Read more about our IP and patents.
June 29, 2022
Smoltek’s 75th patent has been granted in Taiwan and is covering the concept and manufacturing of extremely thin energy storage devices embedded in an interposer. The energy storage device concepts can take a large number of forms e.g. discrete, integrated – or it may take the form where the end result is an interposer with CNF-MIM capacitors embedded in it. And the Compact energy storage interposer family is developed to capture around that concept.
“Through these two new patents, Smoltek again proves our ability both in technical and innovative capabilities of widening our IP footprint”,
says Farzan Ghavanini, CTO and Head of R&D at Smoltek.
Smoltek’s 76th patent has been granted in Korea and relates to the Assembly platform family in the field of interconnects and heterogeneous integration. This particular patent family is a pathway to tap into the ever-increasing demand for miniaturization of electronic components and interconnect them in the form of an assembly to minimize footprint at the packaging level.
Smoltek’s patent portfolio now globally comprises 76 granted patents. Read more about our IP and patents.
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Your data will be handled in compliance with our privacy policy.
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