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Smoltek’s IP related to interposer technology keeps growing. This new US patent is covering energy storage devices embedded in an interposer, and manufacturing of the same. Our patent portfolio now comprises 62 granted patents.
Smoltek’s inventions facilitate integration of extremely thin solid-state energy storage devices, CNF-MIM capacitors, closer to the interconnection points and power rails of the active chips. The CNF-MIM technology offers the industry’s smallest formfactor for high-performance capacitors by providing a very high capacitance per area at a fragment of the height compared to today’s technologies.
In the semiconductor industry the Advanced Packaging and Heterogeneous Integration concepts offers architectures for increased functionality and enhanced performances on a system level together with an ever-smaller footprint. Interposers are important building-blocks in these architectures. Silicon interposers have so far mainly been utilized for high-end semiconductors such as high-performance GPUs, CPUs, FPGAs, and HBMs, while the mid-end segment has a greater share of organic interposers due to cost issues. The point is that interposers today is a key sub-component and a main staple technology.
With this newly granted patent, we are expanding our interposer-related protection scheme on the US market.
“Interposers are frequently and increasingly used in advanced semiconductor products. We are happy to make our technology even more relevant to the industry by facilitating further improved performance and thereby adding significant value.”, says Dr Shafiq Kabir, Founder and Chief Innovation Officer at Smoltek.
Traditionally, an interposer has been used only for passive redistributions layers (RDL) or interconnects for other dies to be connected. Over time other passive functionality has been added, such interposers are often referred to as “smart interposers”. Our patented concept comprises energy storage devices, e.g. capacitors, solid state micro batteries etc., to be embedded in the interposer structure.
The market for such interposers is anticipated to steadily grow in the field of Advanced Packaging and Heterogeneous Integration. Our Compact Energy Storage Interposer family is complementary to our other Interposer families and offers an additional path to utilize our CNF-MIM technology.
Smoltek’s patent portfolio now globally comprises 62 granted patents. Read more about our IP and patents.
Image: Shafiq Kabir, CIO at Smoltek
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News
June 27, 2025
Smoltek Semi has cleared a significant milestone in the development of next-generation CNF-MIM capacitors. Samples from the latest prototype generation, fabricated with an advanced dielectric stack composed of zirconium oxide (ZrO₂) and aluminum oxide (Al₂O₃) have demonstrated exceptional stability under both temperature and voltage stress.
News
June 18, 2025
Smoltek Semi has initiated the signing of a technical service agreement with the Taiwanese Industrial Technology Research Institute (ITRI) that enables low-volume production of Smoltek's propriety CNF-MIM capacitors.
IR Blog Posts
June 16, 2025
Smoltek Semi joins an elite club of companies achieving 1 µF/mm² capacitance density, but stands alone in reaching this milestone with an ultra-thin profile. This breakthrough unlocks the under-chip real estate that represents the holy grail of capacitor placement in modern electronics.
News
June 12, 2025
Smoltek Hydrogen is developing Smoltek PTE – a proprietary porous transport electrode based on carbon nanostructures, which is intended to meet the requirements of next-generation PEM electrolyzers for the production of fossil-free hydrogen.
News
June 11, 2025
Smoltek Semi has successfully engineered an advanced dielectric stack that surpasses 1 microfarad per Square millimeter capacitance milestone.