Our technology

Smoltek specializes in development of nanostructure fabrication technology to solve advanced materials engineering problems. 

Solutions for the new wave of microelectronics

In the pursuit of miniaturization in the semiconductor industry Smoltek has developed a number of concepts and prototypes aimed for advanced packaging and heterogenous integration that will provide higher performance with a lower profile and a significantly reduced footprint.

CNF-MIM - Capacitor technology platform 

Smoltek's CNF-MIM capacitor technology is a revolutionizing way of making high performance capacitors with an extremely small footprint and a very thin profile. 

The CNF-MIM capacitor technology platform enables production of several different types of capacitor components, including discrete passives, embedded capacitors and capacitors directly integrated on the chip. All done in a CMOS-compatible process.

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Smoltek innovation opportunities

Smoltek has developed an extensive IP portfolio with more than 80 patents granted and pending. Our innovative nanotechnology can be used in almost any technological platforms and/or applications where today's materials no longer are up for the task. Together with a significant body of know-how our technology platform offers a huge variation of business opportunities .

SMOLTEK Tiger - Smart assembly platform

Applications in SMOLTEK Tiger™
CNF-MIM - integrated capacitors 

Smoltek's CNF-MIM capacitor technology is a revolutionizing way of making high performance capacitors with an extremely small footprint and a very thin profile. 

SmolINCO - Component Integration Interconnects

The SmolINCO™ concept improves the overall performance and reliability of existing Cu-based microbump technology and smoothens the scaling path down to ~5μm pitch, and beyond that solder free thermal compression bonding.

SmolINPO - Interposers concept

SmolINPO™ is our interposer concept based on super conductive nanostructures. It facilitates ultra-fine pitch integration of multi-die SiP (System-in-Package) components as well as with integrated solid-state mini-supercapacitors for multiple functions. 

SmolTIM - Thermal enhancement materials

SmolTIM™ is Smoltek’s heat dissipation concept that facilitates higher performance and sustained lifetime for RF and Power Electronics components.  

SmoltekTiger™ is an assembly platform concept for advanced packaging and heterogenous integration that consists of integrated capacitors, interconnects and interposers that are incapsulated by an thermal heat dissipation film.

Other applications & technology concepts

SmolNIL - Nano imprint lithography 

SmolNIL™ is our nanoscale imprint technology that enables us to fabricate high aspect ratio (>1:10) imprint mold/mask with predefined shapes.

SmolCAP - Supercapacitors concept

SmolCAP™ is an ultrathin high performance supercapacitor concept  based on our carbon nanofiber technology. 

SmolGROW - Core technology

SmolGROW™ is Smoltek’s core technology of controlled growth which enables us to engineer nanostructures on any substrate in a controlled way and with the flexibility to define and tailor the properties of the grown nanostructure exactly how we desire. 

Smoltek provides groundbreaking technology for the new wave of heterogeneous integration and advanced semiconductor packaging. 

By pioneering carbon nanotechnology we keep scaling advanced semiconductor packaging technologies on a system level.

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© 2005-2019 by Smoltek

Headquarters
Kaserntorget 7, S411 18 Gothenburg, Sweden

info@smoltek.com | +46 760 52 00 53

US location

470 Ramona Street, Palo Alto, CA 94301, USA

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