Our technology
Smoltek specializes in development of nanostructure fabrication technology to solve advanced materials engineering problems.
Solutions for the new wave of microelectronics
In the pursuit of miniaturization in the semiconductor industry Smoltek has developed a number of concepts and prototypes aimed for advanced packaging and heterogenous integration that will provide higher performance with a lower profile and a significantly reduced footprint.
CNF-MIM – Capacitor technology platform
Smoltek's CNF-MIM capacitor technology is a revolutionizing way of making high performance capacitors with an extremely small footprint and a very thin profile.
The CNF-MIM capacitor technology platform enables production of several different types of capacitor components, including discrete passives, embedded capacitors and capacitors directly integrated on the chip. All done in a CMOS-compatible process.
Smoltek CNF-MIM technology – explained
Smoltek has developed an extensive IP portfolio with more than 100 patents granted and pending. Our innovative nanotechnology can be used in almost any technological platforms and/or applications where today's materials no longer are up for the task. Together with a significant body of know-how our technology platform offers a huge variation of business opportunities.
SMOLTEK Tiger™ – Smart assembly platform
Applications in SMOLTEK Tiger™
CNF-MIM – integrated capacitors
Smoltek's CNF-MIM capacitor technology is a revolutionizing way of making high performance capacitors with an extremely small footprint and a very thin profile.
SmolINCO – Component Integration Interconnects
The SmolINCO™ concept improves the overall performance and reliability of existing Cu-based microbump technology and smoothens the scaling path down to ~5μm pitch, and beyond that solder free thermal compression bonding.
SmolINPO – Interposers concept
SmolINPO™ is our interposer concept based on super conductive nanostructures. It facilitates ultra-fine pitch integration of multi-die SiP (System-in-Package) components as well as with integrated solid-state mini-supercapacitors for multiple functions.
SmolTIM – Thermal enhancement materials
SmolTIM™ is Smoltek’s heat dissipation concept that facilitates higher performance and sustained lifetime for RF and Power Electronics components.
SmoltekTiger™ is an assembly platform concept for advanced packaging and heterogenous integration that consists of integrated capacitors, interconnects and interposers that are incapsulated by an thermal heat dissipation film.
Other applications & technology concepts
SmolNIL – Nano imprint lithography
SmolNIL™ is our nanoscale imprint technology that enables us to fabricate high aspect ratio (>1:10) imprint mold/mask with predefined shapes.
SmolCAP – Supercapacitors concept
SmolCAP™ is an ultrathin high performance supercapacitor concept based on our carbon nanofiber technology.
SmolGROW – Core technology
SmolGROW™ is Smoltek’s core technology of controlled growth which enables us to engineer nanostructures on any substrate in a controlled way and with the flexibility to define and tailor the properties of the grown nanostructure exactly how we desire.