semiconductor

Smoltek’s capacitor technology explained

Smoltek’s capacitor technology explained

Farzan Gha­vani­ni, CTO and Head of R&D at Smoltek, explains the unique advan­tages of our dis­rup­tive car­bon nanofiber capac­i­tor tech­nol­o­gy. How we can make extreme­ly small capac­i­tors with high capac­i­tance den­si­ty, which is in high demand as the increas­ing pow­er con­sump­tion of micro proces­sors calls for ultra­thin decou­pling capac­i­tors with Land­side mounting.

CNF-MIM technology license agreement extended – again

CNF-MIM technology license agreement extended – again

Smoltek con­ducts oper­a­tions in the devel­op­ment, indus­tri­al­iza­tion and licens­ing of tech­nol­o­gy solu­tions, based on the com­pa­ny’s patent-pro­tect­ed car­bon nanofiber tech­nol­o­gy, for the semi­con­duc­tor indus­try with­in the Group com­pa­ny Smoltek Semi. Its main focus is the indus­tri­al­iza­tion and com­mer­cial­iza­tion of the company’s ultra-thin CNF-MIM capacitors. 

License agreement for evaluation of CNF-MIM technology extended

License agreement for evaluation of CNF-MIM technology extended

The eval­u­a­tion license agree­ment that Smoltek signed in April 2020 with a glob­al man­u­fac­tur­er of elec­tron­ic com­po­nents has been extend­ed fur­ther. The work with­in this project is car­ried out by the sub­sidiary Smoltek Semi, whose main objec­tive is to devel­op and license the man­u­fac­ture of ultra-thin capac­i­tors based on Smoltek’s patent-pro­tect­ed car­bon nanofiber technology.

Smoltek signs evaluation license agreement with leading capacitor manufacturer

Smoltek signs evaluation license agreement with leading capacitor manufacturer

Smoltek announces that the com­pa­ny has signed an eval­u­a­tion agree­ment with one of the world’s largest capac­i­tor man­u­fac­tur­ers. The agree­ment con­cerns a project with a license for eval­u­a­tion of Smoltek’s patent­ed car­bon nanofiber-based CNF-MIM tech­nol­o­gy. The inten­tion is to replace the eval­u­a­tion agree­ment with a pro­duc­tion license agree­ment as a next step. The order val­ue for this first step amounts to approx­i­mate­ly SEK 1 million.

Assembly platform

Assembly platform

The inven­tion: An assem­bly plat­form for arrange­ment as an inter­pos­er device between an inte­grat­ed cir­cuit and a sub­strate to inter­con­nect the inte­grat­ed cir­cuit and the sub­strate through the assem­bly plat­form, the assem­bly plat­form com­pris­ing: an assem­bly sub­strate; a plu­ral­i­ty of con­duct­ing vias extend­ing through the assem­bly sub­strate; at least one nanos­truc­ture con­nec­tion bump on a first side of the assem­bly sub­strate, the nanos­truc­ture con­nec­tion bump being con­duc­tive­ly con­nect­ed to the vias and defin­ing con­nec­tion loca­tions for con­nec­tion with at least one of the inte­grat­ed cir­cuit and the sub­strate, where­in each of the nanos­truc­ture con­nec­tion bumps com­pris­es: a plu­ral­i­ty of elon­gat­ed con­duc­tive nanos­truc­tures ver­ti­cal­ly grown on the first side of the assem­bly sub­strate, where­in the plu­ral­i­ty of elon­gat­ed nanos­truc­tures are embed­ded in a met­al for the con­nec­tion with at least one of the inte­grat­ed cir­cuit and the sub­strate, at least one con­nec­tion bump on a sec­ond side of the assem­bly sub­strate, the sec­ond side being oppo­site to the first side, the con­nec­tion bump being con­duc­tive­ly con­nect­ed to the vias and defin­ing con­nec­tion loca­tions for con­nec­tion with at least one of the inte­grat­ed cir­cuit and the substrate.