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semiconductorindustry
News
June 30, 2022
Smoltek signs MoU with global manufacturer of capacitors
The Group company Smoltek Semi has signed a Memorandum of Understanding (MoU) with a global manufacturer of capacitors for the joint development of Smoltek's ultra-thin CMF-MIM capacitors and, provided that the development goals are achieved, mass production and sales via a 50/50-owned joint venture.
News
December 17, 2019
Smoltek presents new improved electrical data for CNF-MIM
Smoltek has presented new and improved electrical data for CNF-MIM at EDAPS in Taiwan. The focal point has been on lowering the ESR value that we presented in September.
News
November 27, 2019
Smoltek is attending EDAPS 2019 in Taiwan
The EDAPS conference in Kaohsiung Taiwan, December 16-19 will be an excellent forum to highlight the latest advances for our CNF-MIM capacitor technology concept.
News
November 21, 2019
Smoltek participates in Swedish business delegation to South Korea
Smoltek will be part of a Swedish business delegation going to Seoul, South Korea in December. This gives us the opportunity to connect and have a sit down with Korean semiconductor giants.
News
October 11, 2019
Smoltek patent No. 54 now granted
Smoltek is awarded a new patent. This US patent is the first of a patent family in the direction of CNF-MIM capacitor applications on interposers. This brings our IP portfolio now to consists of 54 granted patents.
News
September 20, 2019
Smoltek practically doubles the capacitance density for CNF-MIM – again
A year ago, the capacitance density for the CNF-MIM capacitor technology was at 200 nF/mm2. In May this year it had risen to 350. And now we nearly have doubled that to +650 nF/mm2!
News
September 5, 2019
A new position and a new face at Smoltek
Karl Lundahl is taking on the new position as Vice President Product Management at Smoltek, with start this fall. Karl has a long track record within the semiconductor, photovoltaic and electronic industries. In particular, Karl is bringing extensive experience in the field of advanced semiconductor packaging.