Is it time to Reinforce In-package Solder Joints Using CNF?

Arti­cle pub­lished in MEPTEC Report, Vol­ume 18, Issue 1.

One-dimen­sion­al car­bon nanos­truc­tures have been known and fab­ri­cat­ed for more than a hun­dred years and were orig­i­nal­ly rWe describe a fast and cost-effec­tive process for the growth of car­bon nanofibers (CNFs) at a tem­per­a­ture com­pat­i­ble with cThe trend towards small­er inter­con­nects is start­ing to present assem­bly and reli­a­bil­i­ty chal­lenges. While desir­able by users, small­er diam­e­ter cop­per pil­lars present an even more sig­nif­i­cant chal­lenge to assem­blers and reli­a­bil­i­ty issues for end-users. How­ev­er, nanos­truc­tures in the form of car­bon nano-fibers (CNFs) embed­ded with sol­der or con­duc­tive epoxy pro­duce stronger com­po­nent inter­con­nec­tions that enable small­er diam­e­ter cop­per pil­lars. If desired, the rein­forced fiber bumps can be less than 10 μm in diam­e­ter and up to 20 μm high. Attach­ment of the fiber micro bumps uses con­ven­tion­al ther­mo­com­pres­sion bonding.

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