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Carbon nanofiber microbump.

Is it time to Reinforce In-package Solder Joints Using CNF?

Article published in MEPTEC Report, Volume 18, Issue 1.

One-dimen­sion­al car­bon nano­struc­tures have been known and fab­ric­ated for more than a hun­dred years and were ori­gin­ally rWe describe a fast and cost-effect­ive pro­cess for the growth of car­bon nan­ofibers (CNFs) at a tem­per­at­ure com­pat­ible with cThe trend towards smal­ler inter­con­nects is start­ing to present assembly and reli­ab­il­ity chal­lenges. While desir­able by users, smal­ler dia­met­er cop­per pil­lars present an even more sig­ni­fic­ant chal­lenge to assem­blers and reli­ab­il­ity issues for end-users. How­ever, nano­struc­tures in the form of car­bon nano-fibers (CNFs) embed­ded with solder or con­duct­ive epoxy pro­duce stronger com­pon­ent inter­con­nec­tions that enable smal­ler dia­met­er cop­per pil­lars. If desired, the rein­forced fiber bumps can be less than 10 μm in dia­met­er and up to 20 μm high. Attach­ment of the fiber micro bumps uses con­ven­tion­al ther­mo­com­pres­sion bonding.

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