Is it time to Reinforce In-package Solder Joints Using CNF?
Article published in MEPTEC Report, Volume 18, Issue 1.
One-dimensional carbon nanostructures have been known and fabricated for more than a hundred years and were originally rWe describe a fast and cost-effective process for the growth of carbon nanofibers (CNFs) at a temperature compatible with cThe trend towards smaller interconnects is starting to present assembly and reliability challenges. While desirable by users, smaller diameter copper pillars present an even more significant challenge to assemblers and reliability issues for end-users. However, nanostructures in the form of carbon nano-fibers (CNFs) embedded with solder or conductive epoxy produce stronger component interconnections that enable smaller diameter copper pillars. If desired, the reinforced fiber bumps can be less than 10 μm in diameter and up to 20 μm high. Attachment of the fiber micro bumps uses conventional thermocompression bonding.