Smoltek’s 66th patent was grant­ed in Chi­na and it fur­ther strength­ens the posi­tion of our growth-relat­ed patent fam­i­ly of Inter­con­nects in the form­ing of nanos­truc­tures and nanos­truc­ture devices.

“Through these three new patents, Smoltek again proves our abil­i­ty both in tech­ni­cal and inno­v­a­tive capa­bil­i­ties of widen­ing our IP foot­print,” says Vin­cent Des­maris, CTO at Smoltek.

Smoltek’s 67th patent has been grant­ed in Japan and relates to the Assem­bly plat­form fam­i­ly in the field of inter­con­nects and het­ero­ge­neous inte­gra­tion. This par­tic­u­lar patent fam­i­ly is a path­way to tap into the ever-increas­ing demand for minia­tur­iza­tion of elec­tron­ic com­po­nents and inter­con­nect them in the form of an assem­bly to min­i­mize foot­print at the pack­ag­ing level.

Smoltek’s 68th patent has been grant­ed in the US and is cov­er­ing the con­cept and man­u­fac­tur­ing of extreme­ly thin ener­gy stor­age devices embed­ded in an inter­pos­er. Our ener­gy stor­age device con­cepts may take many forms e.g. dis­crete, inte­grat­ed or it can take the form where the end result is an inter­pos­er with CNF-MIM capac­i­tors embed­ded in it. And the Com­pact ener­gy stor­age inter­pos­er fam­i­ly is devel­oped to cap­ture around that concept.

Smoltek’s patent port­fo­lio now glob­al­ly com­pris­es 68 grant­ed patents. Read more about our IP and patents.

Image: Smoltek CTO, Vin­cent Desmaris