MEPTEC´s Semiconductor Packaging Symposium

Smoltek will take part in the MEPTEC’s Semi­con­duc­tor Pack­ag­ing Sym­po­sium in Mil­pi­tas, Cal­i­for­nia on Novem­ber 30.

Smoltek is engaged in the event as a spon­sor, but will also be exhibit­ing. CEO Anders Johans­son and CTO Vin­cent Des­maris will rep­re­sent the com­pa­ny at the symposium.

“Smoltek’s dis­rup­tive car­bon nan­otech­nol­o­gy moves the bench­mark and pro­vides com­plete­ly new oppor­tu­ni­ties for man­u­fac­tur­ing of het­ero­ge­neous­ly inte­grat­ed cir­cuits. We are very much look­ing for­ward to once again take part in MEPTEC’s Semi­con­duc­tor Pack­ag­ing Sym­po­sium,” says Anders Johansson.

The sym­po­sium will explore cur­rent chal­lenges and pos­si­bil­i­ties in the semi­con­duc­tor indus­try under the tagline “Het­ero­ge­neous Inte­gra­tion – a road to imple­men­ta­tion”. The event will explore three issues cen­tral to the suc­cess­ful exe­cu­tion of het­ero­ge­neous inte­grat­ed packages:

  • Can the pack­ag­ing com­mu­ni­ty estab­lish a real design for het­ero­ge­neous inte­grat­ed ecosystem?

  • Should we rethink the reli­a­bil­i­ty stan­dards for these het­ero­ge­neous inte­grat­ed SIP packages?

  • What are the best test strate­gies for these het­ero­ge­neous inte­gra­tions, or at least what arethe guid­ing principles?

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