Author: S Kabir

Compact Energy Storage Interposer

Compact Energy Storage Interposer

The inven­tion: An inter­pos­er device com­pris­ing a first con­duc­tor pat­tern on a first side defin­ing a por­tion of the inter­pos­er device to be cov­ered by a first elec­tri­cal cir­cuit ele­ment; and a sec­ond con­duc­tor pat­tern on a sec­ond side to be con­nect­ed to a sec­ond elec­tri­cal cir­cuit ele­ment. The sec­ond con­duc­tor pat­tern is elec­tri­cal­ly cou­pled to the first con­duc­tor pat­tern. The inter­pos­er device fur­ther com­pris­es a plu­ral­i­ty of nanos­truc­ture ener­gy stor­age devices arranged with­in the por­tion of the inter­pos­er device to be cov­ered by the first elec­tri­cal cir­cuit ele­ment. Each of the nanos­truc­ture ener­gy stor­age devices com­pris­es at least a first plu­ral­i­ty of con­duc­tive nanos­truc­tures; a con­duc­tion con­trol­ling mate­r­i­al embed­ding the nanos­truc­tures; a first elec­trode con­nect­ed to each nanos­truc­ture in the first plu­ral­i­ty of nanos­truc­tures; and a sec­ond elec­trode sep­a­rat­ed from each nanos­truc­ture in the first plu­ral­i­ty of nanos­truc­tures by the con­duc­tion con­trol­ling material.

Assembly platform

Assembly platform

The inven­tion: An assem­bly plat­form for arrange­ment as an inter­pos­er device between an inte­grat­ed cir­cuit and a sub­strate to inter­con­nect the inte­grat­ed cir­cuit and the sub­strate through the assem­bly plat­form, the assem­bly plat­form com­pris­ing: an assem­bly sub­strate; a plu­ral­i­ty of con­duct­ing vias extend­ing through the assem­bly sub­strate; at least one nanos­truc­ture con­nec­tion bump on a first side of the assem­bly sub­strate, the nanos­truc­ture con­nec­tion bump being con­duc­tive­ly con­nect­ed to the vias and defin­ing con­nec­tion loca­tions for con­nec­tion with at least one of the inte­grat­ed cir­cuit and the sub­strate, where­in each of the nanos­truc­ture con­nec­tion bumps com­pris­es: a plu­ral­i­ty of elon­gat­ed con­duc­tive nanos­truc­tures ver­ti­cal­ly grown on the first side of the assem­bly sub­strate, where­in the plu­ral­i­ty of elon­gat­ed nanos­truc­tures are embed­ded in a met­al for the con­nec­tion with at least one of the inte­grat­ed cir­cuit and the sub­strate, at least one con­nec­tion bump on a sec­ond side of the assem­bly sub­strate, the sec­ond side being oppo­site to the first side, the con­nec­tion bump being con­duc­tive­ly con­nect­ed to the vias and defin­ing con­nec­tion loca­tions for con­nec­tion with at least one of the inte­grat­ed cir­cuit and the substrate.

Interposer

Interposer

The inven­tion: An inter­pos­er device com­pris­ing an inter­pos­er sub­strate; a plu­ral­i­ty of con­duct­ing vias extend­ing through the inter­pos­er sub­strate; a con­duc­tor pat­tern on the inter­pos­er sub­strate, and a nanos­truc­ture ener­gy stor­age device. The nanos­truc­ture ener­gy stor­age device com­pris­es at least a first plu­ral­i­ty of con­duc­tive nanos­truc­tures formed on the inter­pos­er sub­strate; a con­duc­tion con­trol­ling mate­r­i­al embed­ding each nanos­truc­ture in the first plu­ral­i­ty of con­duc­tive nanos­truc­tures; a first elec­trode con­nect­ed to each nanos­truc­ture in the first plu­ral­i­ty of nanos­truc­tures; and a sec­ond elec­trode sep­a­rat­ed from each nanos­truc­ture in the first plu­ral­i­ty of nanos­truc­tures by the con­duc­tion con­trol­ling mate­r­i­al, where­in the first elec­trode and the sec­ond elec­trode are con­fig­ured to allow elec­tri­cal con­nec­tion of the nanos­truc­ture ener­gy stor­age device to the inte­grat­ed circuit.