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Flip chip interconnects based on carbon nanofibers-solder composites
Research paper published in the proceedings of 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 2229-2234.
Read moreFlip chip interconnects based on carbon nanofibers-solder composites
Reliability, solderability and electrical performance of high density ultra thin capacitors based on carbon nanofibers
Research paper published in the proceedings of 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 1627-1632.
Read moreReliability, solderability and electrical performance of high density ultra thin capacitors based on carbon nanofibers