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V Desmaris
Research
April 16, 2014
Embedded Fibers Enhance Nano-Scale Interconnections
Research paper published in the IPC APEX EXPO Conference Proceedings, March 23–27, 2014.
Research
April 15, 2014
Is it time to Reinforce In-package Solder Joints Using CNF?
Article published in MEPTEC Report, Volume 18, Issue 1.
Research
July 10, 2011
A Test Vehicle for RF/DC Evaluation and Destructive Testing Of Vertically Grown Nanostructures (VGCNS)
Research paper in the proceedings of NT11 International Conference on the Science and Application of Nanotubes, University of Cambridge, United Kingdom, July 10–16, 2011.
Patents
October 18, 2010
Catalyst Diffusion
The Catalyst Diffusion family is covering a method for manufacturing a plurality of nanostructures on a substrate.
Research
August 26, 2009
Nanoimprint lithography using vertically aligned carbon nanostructures as stamp
Research paper published in Nanotechnology, 2009, Volume 20, Number 37, pp. 375302–375306.
Patents
July 23, 2009
Nano Imprint Lithography
The Nano Imprint Lithography family is covering a method of making high aspect ratio template, stamp, and imprinting at nanoscale using nanostructures.
Patents
February 20, 2009
Helplayer
The Helplayer family is covering a method to protect the underlaying substrate or materials from being damaged during the nanostructure growth process.
Research
January 1, 2009
Carbon nanostructures perform high aspect ratio nanoimprinting
Article published in Nanotechweb, 2009.
Patents
September 10, 2008
Bumping
The Bumping family is an apparatus connecting and bonding adjacent layers with nanostructures.
Research
July 18, 2008
Compatibility Assessment of CVD growth of Carbon nanofibers on bulkCMOS devices
Research paper published in Nano Letters 2008, Volume 8, Issue 8, pp. 2437–2441, July 18, 2008.
Patents
August 28, 2006
Interconnects B
The Interconnects B family is covering how nanostructures can be used as interconnects and/or for dissipating heat from electronic devices.
Patents
August 28, 2006
Nanostructure IC
The Nanostructure IC family is covering a method for the manufacture of an integrated circuit comprising nanostructures.
Patents
April 25, 2006
Interconnects A (SmolGROW™)
The Interconnects A family is covering a method regarding controlled growth of a nanostructure on a substrate, and electron emission devices based on the same.
Patents
April 25, 2006
Nanostructure E‑beam writer
The Nanostructure E-beam writer family is covering a method for the manufacture of an integrated circuit comprising nanostructures.