High-frequency electrical circuit model for integrated capacitors utilizing lossy nanostructures
Research paper published in the proceedings of 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 1205–1210.
Author: S Krause
Smoltek’s IP strategy explained
Smoltek’s business model and IP strategy for the company’s extensive patent portfolio have shifted over the years – from scientific curiosity in the beginning into solving advanced industry needs today. In this video, published in November 2020, Dr Shafiq Kabir, Co-founder and former Chief Innovation Officer (CIO) explains how the IP-strategy has transformed as the company has evolved.
Ultrathin High-Density Capacitors based on Carbon Nanofibers Fabricated on Silicon, Alumina and Glass Interposer Materials
Research paper published in the proceedings of 2020 IEEE 20th International Conference on Nanotechnology (IEEE-NANO), 2020, pp. 213–216.
Robustness of carbon nanofiber-based MIM capacitors with ultra-high capacitance density to electrical and thermal stress
Research paper published in the proceedings of 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, pp. 2139–2144.
Integrated and Discrete Ultra-Thin Capacitors Based on Carbon Nanofibers with High Capacitance Density
Research paper published in the proceedings of 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, pp. 1614–1619.
Ultra-Thin Capacitors based on Carbon nanofibers with Ultra-High Capacitance Density
Research paper published in the proceedings of 2019 Electrical Design of Advanced Packaging and Systems (EDAPS), 2019, pp. 1–3.
Fully Solid-State Integrated Capacitors Based on Carbon Nanofibers and Dielectrics with Specific Capacitances Higher Than 200 nF/mm2
Research paper published in the proceedings of 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, pp. 1870–1876.
Compact Energy Storage Interposer
The Compact Energy Storage Interposer family is covering the invention and manufacturing of extremely thin energy storage devices embedded in an interposer.
Breaking barriers: The future
This is the third and last article in a series of three in which Smoltek founder and strategic advisor Shafiq Kabir share his personal thoughts on nanotechnology opportunities. In the previous two articles, he has addressed both the hype and the reality of carbon nanotechnology. In this last article, he looks into the future. He discusses how carbon nanotechnology will unleash the power of the internet of everything.
Breaking barriers: The reality
This is the second article in a series of three in which Smoltek founder and strategic advisor Shafiq Kabir share his personal thoughts on nanotechnology opportunities. In the last article, he addressed the hype surrounding carbon nanotechnology. In this one, he takes you into the reality of the nanotechnology entrepreneur. He tells you about real challenges that await breakthroughs that carbon nanotechnology can help within the near future.
Breaking barriers: The hype
This is the first article in a series of three in which Smoltek founder and strategic advisor Shafiq Kabir share his personal thoughts on nanotechnology opportunities. This introductory article addresses the hype surrounding nanotechnology in general and carbon nanotechnology in particular.
This is Smoltek
What are carbon nanofibers? How can they be used in the semiconductor industry? What is the role of Smoltek? The answers are given in this short, informative video.
Assembly platform
The Assembly platform family is a particular application in the field of interconnects and heterogeneous integration.
Interposer
The Interposer family is covering Smoltek’s CNF-MIM capacitors technology and various use cases for the same, primarily in the field of interposers for advanced packaging and heterogenous integration of semiconductors.
Carbon Nanofibers (CNF) for enhanced solder-based nano-scale integration and on-chip interconnect solutions
Research paper in the proceedings of 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, pp. 1071–1076.
Carbon Nanofibers (CNF) for Enhanced Solder-based Nano-Scale Interconnects and Packaging Solutions
Research paper in the proceedings of Semicon Taiwan 2014.
Is it time to Reinforce In-package Solder Joints Using CNF?
Article published in MEPTEC Report, Volume 18, Issue 1.
A Test Vehicle for RF/DC Evaluation and Destructive Testing Of Vertically Grown Nanostructures (VGCNS)
Research paper in the proceedings of NT11 International Conference on the Science and Application of Nanotubes, University of Cambridge, United Kingdom, July 10–16, 2011.
Catalyst Diffusion
The Catalyst Diffusion family is covering a method for manufacturing a plurality of nanostructures on a substrate.
Nanoimprint lithography using vertically aligned carbon nanostructures as stamp
Research paper published in Nanotechnology, 2009, Volume 20, Number 37, pp. 375302–375306.