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Nanoimprint lithography using vertically aligned carbon nanostructures as stamp
Research paper published in Nanotechnology, 2009, Volume 20, Number 37, pp. 375302–375306.
Nano Imprint Lithography
The Nano Imprint Lithography family is covering a method of making high aspect ratio template, stamp, and imprinting at nanoscale using nanostructures.
Helplayer
The Helplayer family is covering a method to protect the underlaying substrate or materials from being damaged during the nanostructure growth process.
Carbon nanostructures perform high aspect ratio nanoimprinting
Article published in Nanotechweb, 2009.
Bumping
The Bumping family is an apparatus connecting and bonding adjacent layers with nanostructures.
Compatibility Assessment of CVD growth of Carbon nanofibers on bulkCMOS devices
Research paper published in Nano Letters 2008, Volume 8, Issue 8, pp. 2437–2441, July 18, 2008.
Interconnects B
The Interconnects B family is covering how nanostructures can be used as interconnects and/or for dissipating heat from electronic devices.
Nanostructure IC
The Nanostructure IC family is covering a method for the manufacture of an integrated circuit comprising nanostructures.
Interconnects A (SmolGROW™)
The Interconnects A family is covering a method regarding controlled growth of a nanostructure on a substrate, and electron emission devices based on the same.
Nanostructure E‑beam writer
The Nanostructure E-beam writer family is covering a method for the manufacture of an integrated circuit comprising nanostructures.