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Multilayer Cap
The Multilayer Cap patent family introduces a MIM-capacitor device that can double or triple the capacitance density of Smoltek's CNF-MIM capacitors. The patent details an invention for a layered energy storage device, specifically a capacitor, built using a metal-insulator-metal (MIM) configuration.
Discrete CNF-MIM
The Discrete CNF-MIM patent family is covering a method for manufacturing of discrete capacitor components based on our CNF-MIM technology. The innovation exploits the extra-ordinary surface to volume ratio provided by carbon nanofibers to create a MIM capacitor with unparalleled high capacitance density.
High-frequency electrical circuit model for integrated capacitors utilizing lossy nanostructures
Research paper published in the proceedings of 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 1205-1210.
Smoltek’s IP strategy explained
Smoltek's business model and IP strategy for the company's extensive patent portfolio have shifted over the years – from scientific curiosity in the beginning into solving advanced industry needs today. In this video, published in November 2020, Dr Shafiq Kabir, Co-founder and former Chief Innovation Officer (CIO) explains how the IP-strategy has transformed as the company has evolved.
Electrical Performance and Robustness of Ultrathin High-Density Carbon Nanofiber Capacitors on Silicon, Alumina and Glass Substrate Materials
Research paper presented in the proceedings of the 53rd International Symposium on Microelectronics, IMAPS 2020, October 5-8, 2020.
Ultrathin High-Density Capacitors based on Carbon Nanofibers Fabricated on Silicon, Alumina and Glass Interposer Materials
Research paper published in the proceedings of 2020 IEEE 20th International Conference on Nanotechnology (IEEE-NANO), 2020, pp. 213-216.
Robustness of carbon nanofiber-based MIM capacitors with ultra-high capacitance density to electrical and thermal stress
Research paper published in the proceedings of 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, pp. 2139-2144.
Integrated and Discrete Ultra-Thin Capacitors Based on Carbon Nanofibers with High Capacitance Density
Research paper published in the proceedings of 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, pp. 1614-1619.
Ultra-Thin Capacitors based on Carbon nanofibers with Ultra-High Capacitance Density
Research paper published in the proceedings of 2019 Electrical Design of Advanced Packaging and Systems (EDAPS), 2019, pp. 1-3.
Award for best presentation.
Fully Solid-State Integrated Capacitors Based on Carbon Nanofibers and Dielectrics with Specific Capacitances Higher Than 200 nF/mm2
Research paper published in the proceedings of 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, pp. 1870-1876.
Compact Energy Storage Interposer
The Compact Energy Storage Interposer family is covering the invention and manufacturing of extremely thin energy storage devices embedded in an interposer.
This is Smoltek
What are carbon nanofibers? How can they be used in the semiconductor industry? What is the role of Smoltek? The answers are given in this short, informative video.
Assembly platform
The Assembly platform family is a particular application in the field of interconnects and heterogeneous integration.
Interposer
The Interposer family is covering Smoltek's CNF-MIM capacitors technology and various use cases for the same, primarily in the field of interposers for advanced packaging and heterogenous integration of semiconductors.
Carbon Nanofibers (CNF) for Enhanced Solder-based Nano-Scale Interconnects and Packaging Solutions
Research paper in the proceedings of Semicon Taiwan 2014.
Carbon Nanofibers (CNF) for enhanced solder-based nano-scale integration and on-chip interconnect solutions
Research paper in the proceedings of 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, pp. 1071–1076.
Embedded Fibers Enhance Nano-Scale Interconnections
Research paper published in the IPC APEX EXPO Conference Proceedings, March 23–27, 2014.
Is it time to Reinforce In-package Solder Joints Using CNF?
Article published in MEPTEC Report, Volume 18, Issue 1.
A Test Vehicle for RF/DC Evaluation and Destructive Testing Of Vertically Grown Nanostructures (VGCNS)
Research paper in the proceedings of NT11 International Conference on the Science and Application of Nanotubes, University of Cambridge, United Kingdom, July 10–16, 2011.
Catalyst Diffusion
The Catalyst Diffusion family is covering a method for manufacturing a plurality of nanostructures on a substrate.