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Patents
August 1, 2024
The Multilayer Cap patent family introduces a MIM-capacitor device that can double or triple the capacitance density of Smoltek's CNF-MIM capacitors. The patent details an invention for a layered energy storage device, specifically a capacitor, built using a metal-insulator-metal (MIM) configuration.
Patents
June 13, 2023
The Discrete CNF-MIM patent family is covering a method for manufacturing of discrete capacitor components based on our CNF-MIM technology. The innovation exploits the extra-ordinary surface to volume ratio provided by carbon nanofibers to create a MIM capacitor with unparalleled high capacitance density.
Research
August 10, 2021
Research paper published in the proceedings of 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 1205-1210.
Videos
November 30, 2020
Smoltek's business model and IP strategy for the company's extensive patent portfolio have shifted over the years – from scientific curiosity in the beginning into solving advanced industry needs today. In this video, published in November 2020, Dr Shafiq Kabir, Co-founder and former Chief Innovation Officer (CIO) explains how the IP-strategy has transformed as the company has evolved.
Research
November 26, 2020
Research paper presented in the proceedings of the 53rd International Symposium on Microelectronics, IMAPS 2020, October 5-8, 2020.
Research
September 1, 2020
Research paper published in the proceedings of 2020 IEEE 20th International Conference on Nanotechnology (IEEE-NANO), 2020, pp. 213-216.
Research
August 5, 2020
Research paper published in the proceedings of 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, pp. 2139-2144.
Research
August 5, 2020
Research paper published in the proceedings of 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, pp. 1614-1619.
Research
February 27, 2020
Research paper published in the proceedings of 2019 Electrical Design of Advanced Packaging and Systems (EDAPS), 2019, pp. 1-3. Award for best presentation.
Research
August 26, 2019
Research paper published in the proceedings of 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, pp. 1870-1876.
Patents
August 23, 2018
The Compact Energy Storage Interposer family is covering the invention and manufacturing of extremely thin energy storage devices embedded in an interposer.
IR Blog Posts
January 22, 2018
This is the third and last article in a series of three in which Smoltek founder and strategic advisor Shafiq Kabir share his personal thoughts on nanotechnology opportunities. In the previous two articles, he has addressed both the hype and the reality of carbon nanotechnology. In this last article, he looks into the future. He discusses how carbon nanotechnology will unleash the power of the internet of everything.
IR Blog Posts
December 13, 2017
This is the second article in a series of three in which Smoltek founder and strategic advisor Shafiq Kabir share his personal thoughts on nanotechnology opportunities. In the last article, he addressed the hype surrounding carbon nanotechnology. In this one, he takes you into the reality of the nanotechnology entrepreneur. He tells you about real challenges that await breakthroughs that carbon nanotechnology can help within the near future.
IR Blog Posts
November 27, 2017
This is the first article in a series of three in which Smoltek founder and strategic advisor Shafiq Kabir share his personal thoughts on nanotechnology opportunities. This introductory article addresses the hype surrounding nanotechnology in general and carbon nanotechnology in particular.
Videos
October 24, 2017
What are carbon nanofibers? How can they be used in the semiconductor industry? What is the role of Smoltek? The answers are given in this short, informative video.
Patents
May 3, 2017
The Assembly platform family is a particular application in the field of interconnects and heterogeneous integration.
Patents
February 24, 2017
The Interposer family is covering Smoltek's CNF-MIM capacitors technology and various use cases for the same, primarily in the field of interposers for advanced packaging and heterogenous integration of semiconductors.
Research
December 28, 2014
Research paper in the proceedings of Semicon Taiwan 2014.
Research
September 25, 2014
Research paper in the proceedings of 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, pp. 1071–1076.
Research
April 16, 2014
Research paper published in the IPC APEX EXPO Conference Proceedings, March 23–27, 2014.