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Research paper in the proceedings of Semicon Taiwan 2014.
Research paper in the proceedings of 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, pp. 1071–1076.
Research article published in EUROSENSORS 2014, the 28th European Conference on Solid-State Transducers.
Research paper in the proceedings of MEMSWAVE 2014, La Rochelle, France, 30 June–2 July, 2014.
Research paper in the proceedings of Annual World Conference on Carbon (Carbon 2014): Carbon Materials for Ubiquitous and Sustainable Life, Jeju, Korea, 27 June–4 July, 2014.
Research paper in the proceedings of 16th European Conference on Composite Materials, ECCM16, Seville, Spain; 22–26 June, 2014.
Research paper published in the IPC APEX EXPO Conference Proceedings, March 23–27, 2014.
Article published in MEPTEC Report, Volume 18, Issue 1.
Research paper in the proceedings of NT11 International Conference on the Science and Application of Nanotubes, University of Cambridge, United Kingdom, July 10–16, 2011.
The Catalyst Diffusion family is covering a method for manufacturing a plurality of nanostructures on a substrate.
Research paper published in Nanotechnology, 2009, Volume 20, Number 37, pp. 375302–375306.
The Nano Imprint Lithography family is covering a method of making high aspect ratio template, stamp, and imprinting at nanoscale using nanostructures.
The Helplayer family is covering a method to protect the underlaying substrate or materials from being damaged during the nanostructure growth process.
Article published in Nanotechweb, 2009.
The Bumping family is an apparatus connecting and bonding adjacent layers with nanostructures.