Flip chip interconnects based on carbon nanofibers-solder composites
Research paper published in the proceedings of 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 2229–2234.
Research paper published in the proceedings of 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 2229–2234.
Research paper published in the proceedings of 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 1627–1632.
Research paper published in the proceedings of 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 1205–1210.
Research paper published in the proceedings of 2nd PCNS Passive Components Networking Symposium, Bucharest, Romania, 10–13 September, 2019.
Research paper published in the proceedings of 2020 IEEE 20th International Conference on Nanotechnology (IEEE-NANO), 2020, pp. 213–216.
Research paper published in the proceedings of 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, pp. 2313–2318.
Research paper published in the proceedings of 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, pp. 2139–2144.
Research paper published in the proceedings of 2020 IEEE 70th Electronic Components and Technology Conference (ECTC), 2020, pp. 1614–1619.
Research paper published in the proceedings of 2019 Electrical Design of Advanced Packaging and Systems (EDAPS), 2019, pp. 1–3.
Research paper published in the proceedings of 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2019, pp. 1870–1876.
The Compact Energy Storage Interposer family is covering the invention and manufacturing of extremely thin energy storage devices embedded in an interposer.
Research paper published in the proceedings of 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 2018, pp. 1382–1388.
Research paper published in Advanced Materials Letters, 2018, Volume 9, Issue 6, pp. 444–449.
Research paper published in Solid–State Electronics, Volume 139, January 2018, pp. 75–79.
Research paper published in the proceedings of 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 2017, pp. 173–178.
Article published in Chip Scale Review, Jul–Aug, 2017, pp. 38–40.
The Interposer family is covering Smoltek’s CNF-MIM capacitors technology and various use cases for the same, primarily in the field of interposers for advanced packaging and heterogenous integration of semiconductors.